Suitable for the Final Visual Inspection (FVI) stage of IC assembly and testing, safeguarding high yield rate of your production lines.

Suitable for the die bonding stage of IC assembly and testing, safeguarding high yield rate of your production lines.

Suitable for off-production-line, modest-scale visual inspection in university laboratories or inside the offices of small and medium enterprises.

Suitable for the post-wafer dicing stage of IC assembly and testing, safeguarding high yield rate of your production lines.

Suitable for product inspection and photography for record keeping before FOSB shipment.

Suitable for the post-marking stage of IC assembly and testing, safeguarding high yield rate of your production lines.

Suitable for the post-molding stage of IC assembly and testing, safeguarding high yield rate of your production lines.

Suitable for the Trim/Form stage of IC assembly and testing, safeguarding high yield rate of your production lines.

Supporting 2D and 3D dispensing on cambered surface. Supporting CCD machine vision precision dispensing.

LEADERG INC. successfully developed “one-tip two-leaf” image analysis algorithm for its future cost-effective, tea-plucking robots.