LEADERG A4 for Molding - LEADERG Cloud-based Automated Optical Inspection (AOI) System

 

Are you looking for a high-speed, high-accuracy Automated Optical Inspection (AOI) System for post-molding inspection?    

 

Are you already frustrated with human misjudgment, inspection inefficiency, and low yield rate currently on your production lines?

 

Relief has arrived--look no further than LEADERG Cloud-based AOI System - LEADERG A4! :)

 

 

 

LEADERG A4 for Molding-1.jpg

 

 

 

Mission of This Production Stage:

 

The molding process is where epoxy compound (resin) is loaded onto the pre-heated lead frames and the wired silicon chips off wire bonding process, forming packages under heat and pressure between top and bottom molds.  After the compound cools off and hardens inside the molds, the shell it forms will help to isolate the chips against outward humidity and to prevent the metal wire from corrosion.  

 

During this process, the integrity of lead frames and epoxy compound package might suffer from scratches, dents, voids, bubbles, contamination, or deformation.  LEADERG A4 for Molding can perform highly efficient and effective visual inspection, screening exterior defects post-molding process, while offering accurate yield rate analyses. 

 

 

 

 

In the Past, You Only Have These Options:

 

1.  Screening with Naked Eye Inspection :

 

-  Limited human reliability in package and chip inspection, while causing severe eye strain in operators

 

-  Highly variable in quality of each shipment, subject to individual operators' own judgment

 

-  High underkill rate, adding to growing customer dissatisfaction

 

-  Labor intensive and inefficient, with steep administrative and managerial cost

 

 

2.  Screening with Other AOI Systems on the Market: 

 

-  Steep financial and time cost of imported machine purchases and maintainence

 

-  Limited after-sales service and support; lack of flexibility in adjusting to immediate production changes

 

-  Uncertain and unstable results, when trying to meet your company's requirement of inspection speed and accuracy

 

 

 

 

LEADERG Cloud-based AOI System - 

LEADERG A4 for Molding 

 

 

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Our Competitive Advantages:

 

 

1.  A Customized, End-to-end Product Design to Suit Local Needs: 

 

  • Localized, Customized, and Immediate Service:  Our locally based teams of engineers can quickly cutomize, modify, and test our AOI systems to suit your production lines' special needs.  No waiting necessary!

 

  • End-to-end System Design:  We are specialized in cost-efficient software/hardware integrated design.  With locally sourced high-quality hardware parts and update-on-demand software design, we can meet our clients' every needs with most cost-efficient solutions.

 

  • Stainless Steel-Plated, State-of-the-Art Chassis:  Our attention to every hardware design detail helps to extend our product's service life and reduce maintenance cost.
 
 

2. Two Exclusive Technologies to Exceed Our Clients' Expectations:

 

  • Exclusive Cloud Computing Technology:  Our highly effective algorithms and cloud computing design will yield immediate improvement in the underkill and overkill rate of your product inspection, exceeding industry standard by far!

 

  • Exclusive Big Data Analysis Technology:  Our AOI System is capable of real-time analysis of product yield rate, helping our clients to quickly discover the crux of the problem on their production lines!
 

 

 

 

 

Accurate, high-speed, high price-performance ratio!

 

Most cost-efficient AOI System, but with optimal results!

 

Choose LEADERG and let your products LEAD the market!

 
 

 

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(LEADERG Cloud-based AOI System, Cloud Computing Architecture)

 

 

 

Inspection Items:

 

Void  
Bubble  
Incomplete Fill  
Package Dent  
Package Chip Out   
Package Crack   
Rough Surface  
Resin Bleed on Lead  
Foreign Material   
Contamination  
Package Scratch  
Circular Hole Deformation   
Strake Overflow  
Package Discoloration  
Off-set / Off-center  
Mold Flash   
Chip Exposure  
Cu Powder Residue  
L/F Misorientation  
Turbulent Exposure  
Flow Mark  
Broken Lead  
Deformation Lead  
Fan-shaped Lead  
Exposed Wire  
Mixed Compound   
Ejector Pin or Pin 1 Hole Imprint  
E-Pin Flash  

 

 

 

 

Allow us to design optimal-quality, satisfaction-guaranteed AOI solutions for your production lines with best results in mind!

 

 

 

 

 

Contact Us and How to Buy

Welcome to contact us. Please refer to the following link:
https://www.leaderg.com/article/index?sn=11059

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Thanks for our customers

Taiwan University, Tsing Hua University, Yang Ming Chiao Tung University, Cheng Kung University, Taipei Medical University, Taipei University of Nursing and Health Sciences, National Chung Hsing University, Chi Nan University, Ilan University, United University, Defence University, Military Academy, Naval Academy, Feng Chia University, Chang Gung University, I-Shou University, Shih Chien University, Taiwan University of Science and Technology, Taichung University of Science and Technology, Yunlin University of Science and Technology, Chin-Yi University of Science, Formosa University, Pintung University of Science and Technology, Kaohsiung University of Science and Technology, Chaoyang University of Technology, Ming Chi University of Technology, Southern Taiwan University of Science and Technology, China University of Technology, Gushan Senior High School, Taipei Veterans General Hospital, Chang Gung Medical Foundation, Tzu Chi Medical Foundation, E-Da Hospital, Industry Technology Research Institute, Institute for Information Industry, Chung-Shan Institute of Science and Technology, Armaments Bureau, Ministry of Justice Investigation Bureau, Institute of Nuclear Energy Research, Endemic Species Research Institute, Institute of Labor, Occupational Safety And Health, Metal Industries Research & Development Centre, Taiwan Instrument Research Institute, Automotive Research & Testing Center, Taiwan Water Corporation, Taiwan Semiconductor Manufacturing Co., Ltd., United Microelectronics Corp., Nanya Technology, Winbond Electronics Corp., Xintec Inc., Arima Lasers Corporation, AU Optronics Corporation, Innolux Corporation, HannStar Display Corporation, Formosa Plastics Group., Formosa Technologies Corporation, Nan Ya Plastics Corp., Formosa Chemicals & Fibre Corporation, Chinese Petroleum Corporation, Logitech, ELAN Microelectronics Corp., Lextar Electronics Corporation, Darfon Electronics Corp., WPG Holdings, Mirle Automation Corporation, Symtek Automation Asia Co., Ltd, ChipMOS Technologies Inc., Dynapack International Technology Corporation, Primax Electronics Ltd., Feng Hsin Steel, China Ecotek, Grade Upon Technology Corp., AAEON Technology Inc., Stark Technology, Inc., Horng Terng Automation Co., Ltd., Zhen Ding Technology Holding Ltd, Boardtek Electronics Corporation, MiTAC International Corporation, Allion Labs, Inc., Sound Land Corp., Hong Hu Tech, etc.