LEADERG A2 for Die Saw - LEADERG Cloud-based Automated Optical Inspection (AOI) System

 

 

 

Are you looking for a high-speed, high-accuracy Automated Optical Inspection (AOI) System for post wafer saw inspection?    

 

Are you already frustrated with human misjudgment, inspection inefficiency, low yield rate, and low customer satisfaction currently on your production lines?

 

Relief has arrived--look no further than LEADERG Cloud-based AOI System - LEADERG A2! :)

 

 

 

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Mission of This Production Stage:

 

The wafer dicing process is where mechanical or laser-based dicing blades are applied to wafers, separating individual dies.  During this process, the integrity of dies might suffer from scratches, cracks, chipping, peeling, or misalignment.

 

LEADERG A2 for Die Saw can perform highly efficient and effective visual inspection, screening exterior defects prior to die bonding process, while offering accurate yield rate analyses. 

 

 

 

 

In the Past, You Only Have These Options:

 

1.  Screening with Human Microscopy Inspection :

 

-  Limited human reliability in die and wafer inspection, while causing severe eye strain in operators

 

-  Highly variable in quality of each shipment, subject to individual operators' own judgment

 

-  High underkill rate, adding to growing customer dissatisfaction

 

-  Labor intensive and inefficient, with steep administrative and managerial cost

 

 

2.  Screening with Other AOI Systems on the Market: 

 

-  Steep financial and time cost of imported machine purchases and maintainence

 

-  Limited after-sales service and support; lack of flexibility in adjusting to immediate production changes

 

-  Uncertain and unstable results, when trying to meet your company's requirement of inspection speed and accuracy

 

 

 

 

LEADERG Cloud-based AOI System - 

LEADERG A2 for Die Saw 

 

 

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Our Competitive Advantages:

 

 

1.  A Customized, End-to-end Product Design to Suit Local Needs: 

 

  • Localized, Customized, and Immediate Service:  Our locally based teams of engineers can quickly cutomize, modify, and test our AOI systems to suit your production lines' special needs.  No waiting necessary!

 

  • End-to-end System Design:  We are specialized in cost-efficient software/hardware integrated design.  With locally sourced high-quality hardware parts and update-on-demand software design, we can meet our clients' every needs with most cost-efficient solutions.

 

  • Stainless Steel-Plated, State-of-the-Art Chassis:  Our attention to every hardware design detail helps to extend our product's service life and reduce maintenance cost.
 
 

2. Three Exclusive Technologies to Exceed Our Clients' Expectations:

 

  • Exclusive Cloud Computing Technology:  Our highly effective algorithms and cloud computing design will yield immediate improvement in the underkill and overkill rate of your product inspection, exceeding industry standard by far!

 

  • Exclusive Real-Time Control Technology:  Our AOI System is equipped with a CCD high-speed camera and exclusive real-time control system, capable of acquiring and processing images even when the robotic arm is in motion—maximizing the inspection speed and Unit Per Hour (UPH) outpour!

 

  • Exclusive Big Data Analysis Technology:  Our AOI System is capable of real-time analysis of product yield rate, helping our clients to quickly discover the crux of the problem on their production lines!
 

 

 

 

 

Accurate, high-speed, high price-performance ratio!

 

Most cost-efficient AOI System, but with optimal results!

 

Choose LEADERG and let your products LEAD the market!

 
 

 

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(LEADERG Cloud-based AOI System, Cloud Computing Architecture)

 

 

 

Inspection Items:

 

Micro Crack  
Passivation Peeling   
Topside Chipping  
Miss Chip  
PI Scratch  
Pad Discoloration  
Tape Burr   
Chip Crack    
Silicon Dust   
Misalignment    
Bump Scratch   
Glue on Topside    
Chip Crack on Topside   
Test Key Lifted   
Test Key Bridge   
Deform Bump  
Wafer Broken in Process   
Wafer Chip Out  
Wire Scratch  
Wafer Scratch  
Wafer Crack  

 

 

 

Allow us to design optimal-quality, satisfaction-guaranteed AOI solutions for your production lines with best results in mind!

 

 

Contact Us and How to Buy


Welcome to contact us. Please refer to the following link:

https://www.leaderg.com/article/index?sn=11059


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Thanks for our customers

Taiwan University, Tsing Hua University, Yang Ming Chiao Tung University, Cheng Kung University, Taipei Medical University, Taipei University of Nursing and Health Sciences, National Chung Hsing University, Chi Nan University, Ilan University, United University, Defence University, Military Academy, Naval Academy, Feng Chia University, Chang Gung University, I-Shou University, Shih Chien University, Taiwan University of Science and Technology, Taichung University of Science and Technology, Yunlin University of Science and Technology, Chin-Yi University of Science, Formosa University, Pintung University of Science and Technology, Kaohsiung University of Science and Technology, Chaoyang University of Technology, Ming Chi University of Technology, Southern Taiwan University of Science and Technology, China University of Technology, Gushan Senior High School, Taipei Veterans General Hospital, Chang Gung Medical Foundation, Tzu Chi Medical Foundation, E-Da Hospital, Industry Technology Research Institute, Institute for Information Industry, Chung-Shan Institute of Science and Technology, Armaments Bureau, Ministry of Justice Investigation Bureau, Institute of Nuclear Energy Research, Endemic Species Research Institute, Institute of Labor, Occupational Safety And Health, Metal Industries Research & Development Centre, Taiwan Instrument Research Institute, Automotive Research & Testing Center, Taiwan Water Corporation, Taiwan Semiconductor Manufacturing Co., Ltd., United Microelectronics Corp., Nanya Technology, Winbond Electronics Corp., Xintec Inc., Arima Lasers Corporation, AU Optronics Corporation, Innolux Corporation, HannStar Display Corporation, Formosa Plastics Group., Formosa Technologies Corporation, Nan Ya Plastics Corp., Formosa Chemicals & Fibre Corporation, Chinese Petroleum Corporation, Logitech, ELAN Microelectronics Corp., Lextar Electronics Corporation, Darfon Electronics Corp., WPG Holdings, Mirle Automation Corporation, Symtek Automation Asia Co., Ltd, ChipMOS Technologies Inc., Dynapack International Technology Corporation, Primax Electronics Ltd., Feng Hsin Steel, China Ecotek, Grade Upon Technology Corp., AAEON Technology Inc., Stark Technology, Inc., Horng Terng Automation Co., Ltd., Zhen Ding Technology Holding Ltd, Boardtek Electronics Corporation, MiTAC International Corporation, Allion Labs, Inc., Sound Land Corp., Hong Hu Tech, etc.