LEADERG A2 for Die Saw - LEADERG Cloud-based Automated Optical Inspection (AOI) System

 

Are you looking for a high-speed, high-accuracy Automated Optical Inspection (AOI) System for post wafer saw inspection?    

 

Are you already frustrated with human misjudgment, inspection inefficiency, low yield rate, and low customer satisfaction currently on your production lines?

 

Relief has arrived--look no further than LEADERG Cloud-based AOI System - LEADERG A2! :)

 

 

 

LEADERG A2 for Die Saw scan.png

LEADERG A2 for Die Saw-2.jpg

 

 

Mission of This Production Stage:

 

The wafer dicing process is where mechanical or laser-based dicing blades are applied to wafers, separating individual dies.  During this process, the integrity of dies might suffer from scratches, cracks, chipping, peeling, or misalignment.

 

LEADERG A2 for Die Saw can perform highly efficient and effective visual inspection, screening exterior defects prior to die bonding process, while offering accurate yield rate analyses. 

 

 

 

 

In the Past, You Only Have These Options:

 

1.  Screening with Human Microscopy Inspection :

 

-  Limited human reliability in die and wafer inspection, while causing severe eye strain in operators

 

-  Highly variable in quality of each shipment, subject to individual operators' own judgment

 

-  High underkill rate, adding to growing customer dissatisfaction

 

-  Labor intensive and inefficient, with steep administrative and managerial cost

 

 

2.  Screening with Other AOI Systems on the Market: 

 

-  Steep financial and time cost of imported machine purchases and maintainence

 

-  Limited after-sales service and support; lack of flexibility in adjusting to immediate production changes

 

-  Uncertain and unstable results, when trying to meet your company's requirement of inspection speed and accuracy

 

 

 

 

LEADERG Cloud-based AOI System - 

LEADERG A2 for Die Saw 

 

 

LEADERG A2 for Die Saw-1.jpg

 

 

 

Our Competitive Advantages:

 

 

1.  A Customized, End-to-end Product Design to Suit Local Needs: 

 

  • Localized, Customized, and Immediate Service:  Our locally based teams of engineers can quickly cutomize, modify, and test our AOI systems to suit your production lines' special needs.  No waiting necessary!

 

  • End-to-end System Design:  We are specialized in cost-efficient software/hardware integrated design.  With locally sourced high-quality hardware parts and update-on-demand software design, we can meet our clients' every needs with most cost-efficient solutions.

 

  • Stainless Steel-Plated, State-of-the-Art Chassis:  Our attention to every hardware design detail helps to extend our product's service life and reduce maintenance cost.
 
 

2. Three Exclusive Technologies to Exceed Our Clients' Expectations:

 

  • Exclusive Cloud Computing Technology:  Our highly effective algorithms and cloud computing design will yield immediate improvement in the underkill and overkill rate of your product inspection, exceeding industry standard by far!

 

  • Exclusive Real-Time Control Technology:  Our AOI System is equipped with a CCD high-speed camera and exclusive real-time control system, capable of acquiring and processing images even when the robotic arm is in motion—maximizing the inspection speed and Unit Per Hour (UPH) outpour!

 

  • Exclusive Big Data Analysis Technology:  Our AOI System is capable of real-time analysis of product yield rate, helping our clients to quickly discover the crux of the problem on their production lines!
 

 

 

 

 

Accurate, high-speed, high price-performance ratio!

 

Most cost-efficient AOI System, but with optimal results!

 

Choose LEADERG and let your products LEAD the market!

 
 

 

LEADERG Cloud-based AOI Architecture-1.png

 

(LEADERG Cloud-based AOI System, Cloud Computing Architecture)

 

 

 

Inspection Items:

 

Micro Crack  
Passivation Peeling   
Topside Chipping  
Miss Chip  
PI Scratch  
Pad Discoloration  
Tape Burr   
Chip Crack    
Silicon Dust   
Misalignment    
Bump Scratch   
Glue on Topside    
Chip Crack on Topside   
Test Key Lifted   
Test Key Bridge   
Deform Bump  
Wafer Broken in Process   
Wafer Chip Out  
Wire Scratch  
Wafer Scratch  
Wafer Crack  

 

 

 

Allow us to design optimal-quality, satisfaction-guaranteed AOI solutions for your production lines with best results in mind!

 

 

 

 

Contact Us!

 

E-mail: leaderg@leaderg.com

 

Phone: +886-2-2784-9788 #8001

 

Fax:  +886-2-8192-7152

 

Taipei Office:  6F., No.153, Xinyi Rd. Sec. 3, Da’an Dist., Taipei City 10658, Taiwan (R.O.C.)  

 

Taoyuan Manufacturing Site:  4F., No.32, Keji 1st Rd., Guishan Dist., Taoyuan City 333, Taiwan (R.O.C.)  (inside the Hwa-Ya Technology Park)

 

Tainan Office:  7F., No.349, Zhongshan Rd., Shanhua Dist., Tainan City 741, Taiwan (R.O.C.)

 

 

 


Recommended Article

1.
LEADERG Cloud-based Automated Optical Inspection (AOI) System

2.
LEADERG A.I. Robot Design ODM Services

3.
LEADERG A3 for Die Bond - LEADERG Cloud-based Automated Optical Inspection (AOI) System